Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus

Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus

Blog Article

To date, no printable chipless Radio Frequency Identification (RFID) sensor-related publications in the current literature discuss the possibility of thermocouple integration, particularly for the use in extreme environments.Furthermore, the effects of a time-dependent stimulus on the scattering parameters of a chipless RFID have never been discussed in the known literature.This work includes a review of possible methods to achieve this goal and the design and characterization of a Barium read more Strontium Titanate (BST) based VHF/UHF voltage sensing circuit.Proof-of-concept thermocouple integration was attempted, and subsequent testing was performed using a signal generator.These subsequent tests involved applying ramp and sinusoid voltage waveforms to the circuit turbo air m3f24-1-n and the characteristics of these signals are largely extracted from the scattering response.

Overall conclusions of this paper are that thermocouple integration into chipless RFID technology is still a significant challenge and further work is needed to identify methods of thermocouple integration.With that being said, the developed circuit shows promise as being capable of being configured into a conventional chipless RFID DC voltage sensor.